Singapore, Singapore

Haijing Cao

This inventor holds 40 USPTO granted patents and 2 published patent applications, primarily in Integrated Passive Devices. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2008-2019.

USPTO Granted Patents = 40 

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 9

Forward Citations = 505(Granted Patents)


Location History:

  • Singapore, CN (2015)
  • Singapore, SG (2008 - 2019)

Company Filing History:


Years Active: 2008-2019

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Areas of Expertise:
Integrated Passive Devices
Semiconductor Packaging
Vertical Interconnect Structures
Fan-Out Structure
Solder Bump
High-Frequency Circuit
Through Silicon Vias
Conductive Pillars
Inductor Formation
Wafer Level Integration
Passive Circuit Elements
Encapsulant Technologies
40 patents (USPTO):Explore Patents

Title: **Innovative Contributions of Haijing Cao in Semiconductor Technology**

Introduction

Haijing Cao, an accomplished inventor based in Singapore, has made significant strides in the field of semiconductor technology, amassing a remarkable portfolio of 40 patents. His innovative work has paved the way for advancements in integrated passive devices (IPD) and their applications within semiconductor systems.

Latest Patents

Cao's recent patents encompass cutting-edge technologies designed to enhance semiconductor devices. One of his notable inventions is a semiconductor device and method of forming a shielding layer over an integrated passive device using conductive channels. This invention involves a complex process of layering conductive and insulating materials to create a robust IPD capable of functioning as an inductor, capacitor, or resistor. The design includes a shielding layer that is electrically connected to conductive pillars, effectively shielding the IPD from electromagnetic interference, which is crucial for the reliability and performance of electronic devices.

Another significant patent details a method for forming a vertical interconnect structure in a substrate for connecting IPDs and baseband circuits. This invention introduces a conductive via that is strategically placed to minimize substrate thickness while enhancing heat management and connectivity between semiconductor dies. The process also emphasizes the formation of heat sinks and efficient encapsulation methods, ensuring optimal performance of the semiconductor components.

Career Highlights

Haijing Cao's career is marked by his role at Stats Chippac Pte. Ltd., where he has contributed his expertise in semiconductor technology. His patents reflect a deep understanding of the nuances of semiconductor design and functionality, setting a foundation for continued innovation in the field.

Collaborations

Cao collaborates with fellow researchers and inventors, including Yaojian Lin and Jianmin Fang, fostering a creative environment that encourages the exchange of ideas and collaborative solutions to complex semiconductor challenges. These partnerships have proven instrumental in enhancing the scope and impact of their collective work.

Conclusion

Through his impressive portfolio of patents and his relentless pursuit of innovation, Haijing Cao has established himself as a key figure in semiconductor technology. His contributions not only advance the capabilities of semiconductor devices but also inspire future innovations within the industry. As technology continues to evolve, inventors like Cao are crucial in shaping the future landscape of electronics.

Profile summary based on public USPTO records.
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