Company Filing History:
Years Active: 2022-2025
Title: Haifa Hariri: Innovator in Electronic Packaging
Introduction
Haifa Hariri is a prominent inventor based in Phoenix, AZ (US). She has made significant contributions to the field of electronic packaging, holding a total of 5 patents. Her work focuses on innovative methods for modulating inductance within electronic packages, which are crucial for modern electronic devices.
Latest Patents
One of her latest patents is titled "Stepped coax MIL PTHS for modulating inductance within a package." This invention includes electronic packages with embedded inductors and outlines methods for forming such packages. The design features a package core with a plated through hole (PTH) and a magnetic shell that enhances the inductive properties. Another notable patent is "In-plane inductors in IC packages," which describes an integrated circuit (IC) package substrate that incorporates a magnetic material within a dielectric material. This innovative design optimizes the performance of electronic components by strategically embedding metallization levels.
Career Highlights
Haifa Hariri is currently employed at Intel Corporation, where she continues to push the boundaries of electronic packaging technology. Her expertise and innovative mindset have positioned her as a key player in her field.
Collaborations
Throughout her career, Haifa has collaborated with talented individuals such as Krishna Bharath and Brandon C Marin. These partnerships have fostered a creative environment that encourages the development of groundbreaking technologies.
Conclusion
Haifa Hariri's contributions to electronic packaging and her innovative patents reflect her dedication to advancing technology. Her work not only enhances the performance of electronic devices but also sets a foundation for future innovations in the industry.