The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Sep. 25, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Brandon C. Marin, Chandler, AZ (US);

Krishna Bharath, Phoenix, AZ (US);

Haifa Hariri, Phoenix, AZ (US);

Tarek A. Ibrahim, Mesa, AZ (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 41/04 (2006.01); H01F 41/14 (2006.01); H01F 41/32 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 41/041 (2013.01); H01F 41/046 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H01L 23/645 (2013.01); H01F 2017/002 (2013.01); H01F 41/14 (2013.01); H01F 41/32 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01);
Abstract

Embodiments disclosed herein include electronic packages with embedded inductors and methods of forming such electronic packages. In an embodiment, the electronic package comprises a package core, and a plated through hole (PTH) through a thickness of the package core. In an embodiment, the electronic package further and a magnetic shell around a perimeter of the PTH, where a height of the magnetic shell is less than the thickness of the package core. In an embodiment, the magnetic shell comprises a substantially vertical sidewall and a bottom surface that is tapered.


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