The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 17, 2025
Filed:
Feb. 28, 2020
Intel Corporation, Santa Clara, CA (US);
Brandon C. Marin, Chandler, AZ (US);
Tarek Ibrahim, Mesa, AZ (US);
Prithwish Chatterjee, Tempe, AZ (US);
Haifa Hariri, Phoenix, AZ (US);
Yikang Deng, Saratoga, CA (US);
Sheng C. Li, Gilbert, AZ (US);
Srinivas Pietambaram, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit (IC) package substrate, comprising a magnetic material embedded within a dielectric material. A first surface of the dielectric material is below the magnetic material, and a second surface of the dielectric material, opposite the first surface, is over the magnetic material. A metallization level comprising a first metal feature is embedded within the magnetic material. A second metal feature is at an interface of the magnetic material and the dielectric material. The second metal feature has a first sidewall in contact with the dielectric material and a second sidewall in contact with the magnetic material.