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For the Inventor, By the Inventor

Yongin, South Korea

Gi-jung Kim

This inventor holds 5 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 1999-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gi-jung Kim. Retrieved from https://idiyas.com/inventor/gi-jung-kim-ki6emx1v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 4.2

ph-index = 3

Forward Citations = 40(Granted Patents)


Location History:

  • Kyungki-do, KR (1999 - 2003)
  • Yongin-si, KR (2012 - 2015)

Company Filing History:

goldMedal5 out of 138,671 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 1999-2015

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5 patents (USPTO):Explore Patents
1. 9035309 - 3D CMOS image sensors, sensor systems including the same (2015-05-19),
2. 8143142 - Method of fabricating epi-wafer, epi-wafer fabricated by the method, and image sensor fabricated using the epi-wafer (2012-03-27),
3. 6552337 - Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements (2003-04-22),
4. 5980720 - Methods of treating crystal-grown wafers for surface defect analysis (1999-11-09),
5. 5972863 - Slurry compositions for polishing wafers used in integrated circuit (1999-10-26),

Title: The Innovations of Gi-jung Kim

Introduction

Gi-jung Kim is a prominent inventor based in Yongin-si, South Korea. He has made significant contributions to the field of image sensor technology, holding a total of five patents. His work primarily focuses on advancements in 3D CMOS image sensors and related sensor systems.

Latest Patents

Among his latest patents is a groundbreaking 3D CMOS image sensor (CIS) that effectively absorbs incident infrared rays (IRs). This innovative sensor includes an IR receiving unit formed in a thin epitaxial film, allowing for easy manufacturing using conventional CIS processes. The sensor system incorporates the 3D CIS and outlines a method for its production. The 3D CIS is designed to absorb IRs through repetitive reflection, generating electron-hole pairs (EHPs). Additionally, an electrode part is formed on the IR receiving part to collect electrons produced by applying a predetermined voltage. Another notable patent involves a method for fabricating an epi-wafer, which includes providing a wafer with boron, growing an insulating layer, performing thermal treatment, and forming a high-density boron layer within the wafer.

Career Highlights

Gi-jung Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology in image sensors. His expertise and innovative approach have positioned him as a key figure in the development of advanced sensor technologies.

Collaborations

He has collaborated with notable coworkers, including Jung-min Park and Young-soo Park, contributing to the success of various projects within the company.

Conclusion

Gi-jung Kim's contributions to the field of image sensor technology are noteworthy, and his patents reflect his commitment to innovation. His work at Samsung Electronics Co., Ltd. continues to influence the future of sensor systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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