Location History:
- Pleasanton, CA (US) (2012 - 2013)
- San Ramon, CA (US) (2012 - 2023)
Company Filing History:
25 out of 728 
1 out of 3,046 
12 out of 832,680 Years Active: 2012-2023
Certainly! Here is the article about inventor Ge Yi:
Title: Innovator Spotlight: Ge Yi - Revolutionizing Semiconductor Packaging and Chip Bonding Technologies
Introduction: Ge Yi, a prolific inventor based in San Ramon, CA, has made significant contributions to the field of semiconductor packaging and chip bonding technologies. With an impressive portfolio of 38 patents, Ge Yi's groundbreaking inventions have reshaped the industry.
Latest Patents: Ge Yi's recent patents include a Metal Spring Anchor for Advanced Packaging - An innovative fan-out packaging system that features a dedicated frame with movable metallic spring anchors for known-good-die (KGD) placement. This system offers exceptional precision during wafer reconstitution processes, making it ideal for chiplets with diverse component chips and substrates. Another notable invention is the Chip Front Surface Touchless Pick and Place Tool or Flip Chip Bonder, designed to handle chips without touching their front surfaces, ensuring utmost cleanliness and productivity.
Career Highlights: Ge Yi has honed his expertise while working at esteemed companies such as Western Digital in Fremont, California. His innovative spirit and dedication to advancing semiconductor technologies have earned him recognition as a leading figure in the industry.
Collaborations: Ge Yi has collaborated with accomplished professionals in the field, including his coworkers Dujiang Wan and Shaoping Li. Their combined efforts have led to the development of cutting-edge solutions that address the industry's evolving needs.
Conclusion: Ge Yi's inventive genius and commitment to excellence continue to drive innovation in semiconductor packaging and chip bonding technologies. His patented inventions represent the forefront of technological advancement, with far-reaching implications for the industry as a whole.
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