Western Digital (fremont), Inc.

Other

Future Wei Technologies, Inc.

Ge Yi

Dujiang Wan

Shaoping Li

Lei Wang

Gerardo Bertero

Guanghong Luo

Dong Li

Qunwen Leng

Hongxing Yuan

Steven C Rudy

Yunfei Li

Yunjun Tang

Ming Mao

Feng Q Liu

Hong Zhang

Hai Sun

Zhongyan Wang

Zongrong Liu

Xiaohai Xiang

Lijie Zhao

Ming Jiang

Michael L Mallary

Shing Lee

Matthew R Gibbons

Derek Van Orden

Sergei L Sochava

Yufeng Hu

Zhong Shi

Wei Gao

Shihai He

Jianwei Mu

Li He

Zhigang Bai

Haiwen Xi

Rongfu Xiao

Li Ping Yang

Xiao Andy Shen

Ming Sun

Michael V Morelli

Jinshan Li

Lien-Chang Wang

Brad Vaughn Johnson

Marc A Finot

Guanxiong Li

Wentao Yan

Ronghui Zhou

Dawei Zheng

Eric J Champion

Yanfeng Chen

Samuel Weisan Yuan

Jinwen Wang

Lisha Wang

Jikou Zhou

Changhe Shang

Wencheng Su

Lily Yao

Jerome S Marcelino

Tiffany Yun Wen Jiang

Yingbo Zhang

Kris Vossough

Fujian Wang

John Love

Guolun Hao

Zhigang Zhou

Srikanth Ganesan

An Fan-out packaging system, comprising dedicated frame with associated movable metallic spring feature(s) for incoming known-good-die (KGD), is invented. The movable spring anchor(s) along with the boundaries of the frame locks the KGD in its designated position during EMC implementation and subsequent processes. In this system/approach, the position accuracy of KGDs during the wafer reconstitution process will be mostly dominated by the dicing accuracy. The proposed system is a very low cost approach as it does not need the expensive software/tool set and does not have a low throughput site-to-site lithography correction during exposure after metrology is carried out for every flash field. This system is particularly useful for chiplet consisting of component chips from different technologies and from substrate made of different material. The frames can be further used as part of function component for the packaged system either as electromagnetic shield, or heat dissipation/heat sink, or even RF antenna as well as other passive devices or active components.

Metal spring anchor for advanced packaging

A piece of pick and place tool or a chip bonding equipment, which has innovative designs enabling chip(s) on a tape to get picked up without touching its front surface, is invented. The designs use levitation technologies to receive and hold the chips detached from the tape from a face-down position. A streamline design is also invented to provide better productivity. The invented pick and place tool or chip bonder is particularly useful for applications which require using chips with zero tolerance of particle and/or contamination on the chip front surfaces.

Chip front surface touchless pick and place tool or flip chip bonder

A portable or handhold air cleaning system, whose air flow pipeline made of highly reflective and low absorptive material for UVC or UVB light acts also as a UV light waveguide, is invented. The system features a TEC cooled LED light source; air flow warm up mechanism; and UV light absorption/air cleaning enhancement device. The system is useful for travellers and office workers during flu and hay-fever seasons.

Air purification system

A CMOS compatible heterogeneously integrated material platform for photonic integrated circuitry is invented. The material platform has SiO2 as cladding material, at least a bottom layer made of moderate refractive index (contrast) material(s), a bonded single crystal Si layer transfer from either a SOI wafer or a ion implanted single crystal Si wafer ready for ion cut split on top of the bottom layer, and some devices enabling light coupling between the devices made within these two layers. The invention provides a great material platform to offer a full set of photonic building blocks for all sorts of different applications such as photonic circuitry for optical neural network, quantum computing, telecommunication, data communication, optical switching, optical sensing, passive and/or active Si optical interposer with its size even bigger than lithography step field.

CMOS compatible material platform for photonic integrated circuits

A method for fabricating a photonic integrated circuit (PIC) comprises providing a silicon-on-insulator (SOI) wafer comprising an insulator layer disposed between a base semiconductor layer and a SOI layer, wherein the SOI layer comprises a waveguide, providing at least one slot within the SOI layer, wherein the at least one slot is positioned on the same or opposite sides of the waveguide, and wherein the at least one slot is positioned at a predetermined distance away from the waveguide, and removing a portion of the insulator layer to form an etched-out portion of the insulator layer, wherein the etched-out portion is positioned directly beneath the waveguide, and wherein a width of the etched-out portion is at least the width of the waveguide.

Enabling thermal efficiency on a silicon-on-insulator (SOI) platform

A heat assisted magnetic recording (HAMR) writer is described. The HAMR writer is coupled with a laser that provides energy having a first polarization state. The HAMR writer has an air-bearing surface (ABS) configured to reside in proximity to a media during use, a plurality of waveguides, a main pole and at least one coil. The main pole writes to the media and is energized by the coil(s). The waveguides receive the energy from the laser and direct the energy toward the ABS. The waveguides include an input waveguide and an output waveguide. The input waveguide is configured to carry light having the first polarization state. The output waveguide is configured to carry light having a second polarization state different from the first polarization state. The waveguides are optically coupled and configured to transfer the energy from the first polarization state to the second polarization state.

Heat assisted magnetic recording writer having integrated polarization rotation waveguides

Apparatuses and methods for providing thin shields in a multiple sensor array are provided. One such apparatus is a magnetic read transducer including a first read sensor, a second read sensor, and a shield assembly positioned between the first read sensor and the second read sensor at an air bearing surface (ABS) of the magnetic read transducer, the shield assembly including a first shield layer assembly having a first footprint with a first area, and a second shield layer assembly having a second footprint with a second area, where the second area is greater than the first area.

Apparatuses and methods for providing thin shields in a multiple sensor array

A method provides a magnetic write apparatus on a substrate. A mask is provided on a substrate. The mask has a trench therein. The trench has a top, a bottom and a plurality of sidewalls extending between the top and the bottom of the trench. The top of the trench is wider than the bottom. A protective layer is provided in the trench. The protective layer extends from the top of the trench along a first portion of the plurality of sidewalls such that the bottom of the trench and a second portion of the plurality of sidewalls are free of the protective layer. The structure is provided in a remaining portion of the trench.

Method for fabricating a magnetic recording device having a high aspect ratio structure

A heat assisted magnetic recording (HAMR) writer is described. The HAMR writer is coupled with a laser and has an air-bearing surface (ABS) that resides near a media during use. The HAMR writer includes a waveguide, a near-field transducer (NFT), a main pole, coil(s) and at least one of a first and a second diffusion barrier layer. The waveguide is optically coupled with the laser and directs energy from the laser toward the ABS. The NFT is optically coupled with the waveguide and focuses the energy onto a region of the media. The main pole writes to the region of the media. The main pole has a top, a bottom, and a plurality of sides. The first diffusion barrier layer is between at least the NFT and the bottom of the pole. The second diffusion barrier layer is adjacent to the plurality of sides of the main pole.

Heat assisted magnetic recording head having a plurality of diffusion barrier layers

A method and system provide a magnetic transducer including first and second read sensors, a shield and a conductive via. The shield is between the first and second read sensors. The magnetic transducer also includes first and second read shields. The shield has a top surface and a bottom surface opposite to the top surface. The bottom surface faces the first read sensor. The conductive via is isolated from the first read shield and the second read shield. The conductive via provides electrical contact to the shield and is electrically connected to the bottom surface of the shield.

Electrical connection arrangement for a multiple sensor array usable in two-dimensional magnetic recording

A method and system provide a magnetic transducer including a first shield, a plurality of read sensors, and a second shield. The read sensors are between the first shield and the second shield. The read sensors have a plurality of widths in a track width direction and are separated by at least one distance in a down track direction. The down track direction is perpendicular to the track width direction.

Multiple sensor array usable in two-dimensional magnetic recording

A wireless magnetic field communication system working within the range of less than 1.5 m without induction induced interference during listening mode is proposed. The system comprises at least a transmitter and a receiver. Several novel transmitter designs using either active-connection-control solenoid or spin-orbit torque (SOT) based patterned thin film element(s) are proposed. The system has intrinsic high data security level due to its limited working range, as well as large data transfer rate. The system is suitable to establish a temporary off-the grid magnetic field communication network. It also provides a new data communication approach among modules instead of data cable in industry equipment. The system can be used as a standalone or built-in system for communication between devices or modularized components of a system.

Wireless near field communication system

A universal fall detect system and its unique designed sensor as well as methodology to detect the fall event are disclosed. The fall event is detected by measuring relative position, and/or orientation between host body and direction of gravity at the spot where falling event happens. The system can present either as a standalone system or a built-in component with supporting software installed on other devices. The system linked to wide network and wide audience can trigger several emergency response and assistances if needed in time when a falling event happens.

Universal fall detection system

A method fabricates a heat assisted magnetic recording (HAMR) transducer having an air-bearing surface (ABS) and that is optically coupled with a laser. The method includes providing a waveguide for directing light from the laser toward the ABS and providing a write pole having a pole tip with an ABS location facing the surface. The pole tip is in a down track direction from the waveguide. The method also includes providing at least one shield including a shield pedestal. The shield pedestal is in the down track direction from the pole tip. At least one protective pad is provided adjacent to the write pole and between the ABS location and the shield pedestal.

Method for providing a heat assisted magnetic recording transducer having protective pads

Growing community of inventors

San Ramon, CA, United States of America

Ge Yi