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For the Inventor, By the Inventor

Hsinchu, Taiwan

Fu-Ting Yen

USPTO Granted Patents = 30 

Average Co-Inventor Count = 4.1

ph-index = 2

Forward Citations = 27(Granted Patents)


Company Filing History:

goldMedal30 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2019-2025

where 'Filed Patents' based on already Granted Patents

30 patents (USPTO):
1. 12439642 - Seam-top seal for dielectrics (2025-10-07),
2. 12412775 - Isolation structures in semiconductor devices (2025-09-09),
3. 12336214 - Inner spacers for gate-all-around semiconductor devices (2025-06-17),
4. 12315837 - Storage layers for wafer bonding (2025-05-27),
5. 12308312 - Interconnect structure and method for manufacturing the interconnect structure (2025-05-20),
6. 12288722 - Spacer structure for semiconductor device and method for forming the same (2025-04-29),
7. 12283618 - Inner spacer for semiconductor device (2025-04-21),
8. 12154822 - Dummy fin structures and methods of forming same (2024-11-26),
9. 11942447 - Storage layers for wafer bonding (2024-03-26),
10. 11915936 - Semiconductor structure and manufacturing method thereof (2024-02-27),
11. 11908921 - Transistor isolation structures (2024-02-20),
12. 11855214 - Inner spacers for gate-all-around semiconductor devices (2023-12-26),
13. 11855213 - FinFET device and method of forming same (2023-12-26),
14. 11664268 - Dummy fin structures and methods of forming same (2023-05-30),
15. 11637062 - Interconnect structure and method for manufacturing the interconnect structure (2023-04-25),

Title: Fu-Ting Yen: Innovating in Semiconductor Technology

Introduction: Fu-Ting Yen, a prolific inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With 22 patents to his name, Yen's work focuses on enhancing wafer bonding processes and semiconductor device manufacturing methods.

Latest Patents:

1. "Storage layers for wafer bonding": Yen's innovative semiconductor structure involves bonded wafers with storage layers, featuring a bonding layer between two wafers with carbon-based storage layers.

2. "Semiconductor structure and manufacturing method": This patent showcases a device with a self-assemble monolayer (SAM) in contact with specific components, improving the overall performance of semiconductor structures.

Career Highlights: Fu-Ting Yen is associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading player in the semiconductor industry known for its cutting-edge technologies and global impact. Yen's expertise and patented inventions have greatly contributed to TSMC's innovation and success in the highly competitive tech landscape.

Collaborations: Alongside his individual achievements, Fu-Ting Yen has collaborated with notable peers in the field, including Teng-Chun Tsai and Keng-Chu Lin. These collaborations have resulted in groundbreaking advancements in semiconductor technology, further solidifying Yen's reputation as a key innovator in the industry.

Conclusion: Fu-Ting Yen's dedication to pushing the boundaries of semiconductor technology through his patents and collaborations underscores his commitment to driving innovation in the field. His work not only benefits TSMC but also the broader tech community, paving the way for future advancements in semiconductor manufacturing and wafer bonding processes.

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