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For the Inventor, By the Inventor

Stuttgart, Germany

Friedjof Heuck

USPTO Granted Patents = 15 

 

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 31(Granted Patents)


Company Filing History:

goldMedal15 out of 29,302 
 
Robert Boschgmbh
 patents

Years Active: 2016-2025

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15 patents (USPTO):
1. 12448280 - Bond structures on MEMS element and ASIC element (2025-10-21),
2. 12404170 - Method for producing a bonding pad for a micromechanical sensor element (2025-09-02),
3. 12160215 - Method for manufacturing a piezoelectric resonator (2024-12-03),
4. 12030773 - Method for producing a wafer connection (2024-07-09),
5. 11560302 - Micromechanical pressure sensor with two cavities and diaphragms and corresponding production method (2023-01-24),
6. 11486782 - Micromechanical device and method for manufacturing a micromechanical device (2022-11-01),
7. 11060937 - Micromechanical pressure sensor (2021-07-13),
8. 10753743 - Micromechanical yaw rate sensor and method for the production thereof (2020-08-25),
9. 10753742 - Micromechanical yaw rate sensor and method for operating same (2020-08-25),
10. 10217926 - Method for producing a multi-layer electrode system (2019-02-26),
11. 10126224 - Particle sensor and method for manufacturing a particle sensor (2018-11-13),
12. 10012828 - Assembly body for micromirror chips, mirror device and production method for a mirror device (2018-07-03),
13. 9593012 - Method for producing a micromechanical component, and corresponding micromechanical component (2017-03-14),
14. 9428378 - Component including two semiconductor elements between which at least two hermetically tightly sealed cavities having different internal pressures are formed and method for manufacturing such a component (2016-08-30),
15. 9233841 - Production process for a micromechanical component and micromechanical component (2016-01-12),

Title: Innovations by Friedjof Heuck

Introduction

Friedjof Heuck is a prominent inventor based in Stuttgart, Germany. He has made significant contributions to the field of microelectromechanical systems (MEMS) and has been awarded 15 patents for his innovative work. His inventions focus on enhancing the functionality and efficiency of MEMS elements and sensor technologies.

Latest Patents

Among his latest patents are two notable innovations. The first patent, titled "Bond structures on MEMS element and ASIC element," describes a MEMS element that includes a substrate, a first passivation layer, a metal layer, a second passivation layer, and a punch element. This design incorporates an electrically conductive diffusion-blocking layer, enhancing the performance of MEMS devices. The second patent, "Method for producing a bonding pad for a micromechanical sensor element," outlines a method for creating a bonding pad that involves depositing metal layers and etching processes to ensure optimal functionality of micromechanical sensors.

Career Highlights

Friedjof Heuck is currently employed at Robert Bosch GmbH, a leading company in the field of technology and engineering. His work at Bosch has allowed him to develop cutting-edge technologies that have applications in various industries, including automotive and consumer electronics.

Collaborations

Throughout his career, Friedjof has collaborated with notable colleagues, including Robert Maul and Thomas Friedrich. These collaborations have fostered an environment of innovation and have contributed to the advancement of MEMS technology.

Conclusion

Friedjof Heuck's contributions to the field of MEMS and sensor technology are significant and impactful. His innovative patents and collaborations highlight his dedication to advancing technology and improving the functionality of microelectromechanical systems.

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