Company Filing History:
Years Active: 2016-2022
Title: Frank Wei: Innovator in Semiconductor Manufacturing
Introduction
Frank Wei is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 6 patents. His innovative approaches have paved the way for advancements in device chip and wiring board manufacturing.
Latest Patents
Frank Wei's latest patents include a device chip manufacturing method and a manufacturing method for wiring boards. The device chip manufacturing method involves attaching a wafer to a semiconductor ingot, separating the ingot into a subject part and a remaining part, and forming a laminated wafer. This process allows for the creation of multiple device chips from a single laminated wafer. The manufacturing method for wiring boards focuses on creating a rewiring layer on a core substrate, which includes forming grooves, electrodepositing metal, and machining the metal layer to achieve a flat exposed face of the wiring layer.
Career Highlights
Frank Wei is currently employed at Disco Corporation, where he continues to innovate in semiconductor technologies. His work has been instrumental in enhancing the efficiency and effectiveness of manufacturing processes in the industry.
Collaborations
Frank has collaborated with notable coworkers such as Hiroshi Morikazu and Nao Hattori. Their combined expertise has contributed to the successful development of advanced manufacturing techniques.
Conclusion
Frank Wei's contributions to semiconductor manufacturing demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in device chip and wiring board production.