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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9576835 B1

PDFFull Text
Date of Patent:
Feb. 21, 2017

Filed:

Nov. 03, 2014

Workpiece processing method

Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Frank Wei, Tokyo, JP;

Hiroshi Morikazu, Tokyo, JP;

Nao Hattori, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:

Green Burns & Crain, Ltd.

Primary Examiner:

Sing P Chan

Int. Cl.
CPC ...
B29C 65/14 (2006.01); B29C 65/16 (2006.01); B32B 37/06 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); H01L 21/00 (2006.01); H01L 21/30 (2006.01); H01L 21/46 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H01L 23/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54493 (2013.01); H01L 2224/11 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A method for processing a workpiece including: a supporting plate preparing step of preparing a supporting plate having, on a top surface side of the supporting plate, a recessed portion configured to house a projecting portion provided in a device region of the workpiece; a positioning step of mounting the workpiece on the supporting plate such that the recessed portion of the supporting plate and the device region of the workpiece correspond to each other; a bonding step of forming a welded region in which the workpiece is welded to the supporting plate by irradiating a peripheral surplus region of the workpiece mounted on the supporting plate with a laser beam, whereby the workpiece is fixed on the supporting plate; and a processing step of processing the workpiece after performing the bonding step.

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