Frank J Juskey

Title: Frank J Juskey: Innovator in Semiconductor Packaging

Introduction

Frank J Juskey is a notable inventor based in Apoka, Florida, recognized for his contributions to semiconductor packaging technology. With a total of seven patents to his name, Juskey has made significant advancements in the field, particularly in low-pressure encapsulation techniques.

Latest Patents

One of Juskey's latest patents is for a low-pressure encapsulant for size-reduced semiconductor packages. This innovative packaging process utilizes a low-pressure encapsulant to enhance the efficiency of semiconductor devices. The process involves creating a vacuum that allows molten mold compound to flow and fill the space between the surface-mounted device and the substrate, ensuring effective encapsulation. Another significant patent focuses on ultrathin flip-chip packaging techniques, which include microelectronic devices with a package substrate and hollow cavity sheet molds. These advancements are crucial for the development of chip-scale packages and modules.

Career Highlights

Throughout his career, Frank J Juskey has worked with prominent companies in the semiconductor industry, including Triquint Semiconductor Corporation and Advanced Interconnect Technologies Limited. His experience in these organizations has contributed to his expertise in semiconductor packaging and innovation.

Collaborations

Juskey has collaborated with notable professionals in the field, including Robert C Hartmann and Thomas Scott Morris. These collaborations have further enriched his work and contributed to the advancements in semiconductor technology.

Conclusion

Frank J Juskey's innovative work in semiconductor packaging has led to significant advancements in the industry. His patents reflect a commitment to improving technology and enhancing the efficiency of electronic devices. His contributions continue to influence the field of microelectronics.