The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 16, 2013

Filed:

Oct. 03, 2011
Applicants:

Frank J. Juskey, Apoka, FL (US);

Paul Bantz, Los Altos, CA (US);

Otto Berger, Grafling, DE;

Inventors:

Frank J. Juskey, Apoka, FL (US);

Paul Bantz, Los Altos, CA (US);

Otto Berger, Grafling, DE;

Assignee:

TriQuint Semiconductor, Inc., Hillsboro, OR (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments include but are not limited to apparatuses and systems including a microelectronic device including a die having a first surface and a second surface opposite the first surface, a conductive pillar formed on the first surface of the die, and an encapsulant material encasing the die, including covering the first surface, the second surface, and at least a portion of a side surface of the conductive pillar. Methods for making the same also are described.


Find Patent Forward Citations

Juskey, Frank. (2013). Sheet-molded chip-scale package (U.S. Patent No. 8487435). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8487435

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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