Los Altos, CA, United States of America

Paul D Bantz

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignees: Triquint Semiconductor Corporation, Qorvo US, Inc.. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul D Bantz. Retrieved from https://idiyas.com/inventor/paul-d-bantz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 2

Forward Citations = 30(Granted Patents)


Company Filing History:


Years Active: 2013-2017

Loading Chart...
3 patents (USPTO):Explore Patents

Title: Paul D Bantz: Innovator in Laminate Substrate Technology

Introduction

Paul D Bantz is a notable inventor based in Los Altos, California. He has made significant contributions to the field of laminate substrate technology, holding a total of 3 patents. His work focuses on advanced grounding schemes and thermal via structures, which are essential in the development of integrated circuit devices.

Latest Patents

One of his latest patents is titled "Advanced Grounding Scheme." This invention describes a laminate substrate that includes a slug positioned within a cavity of a laminate core. The substrate features routing layers on either side of the laminate core, with at least one layer coplanar with the outer side of the slug. A capping layer is applied to the laminate substrate, directly coupled with both the slug and the routing layer. Additionally, a dielectric layer may be coupled with the capping layer, allowing for an inner routing layer that is coplanar with the slug.

Another significant patent is "Thermal Via Structures with Surface Features." This patent outlines apparatuses, methods, and systems for thermal via structures that incorporate surface features with dimensions greater than approximately one micron. These thermal via structures can be integrated into the substrate of an integrated circuit device, enhancing its performance and reliability.

Career Highlights

Throughout his career, Paul D Bantz has worked with prominent companies in the semiconductor industry, including Triquint Semiconductor Corporation and Qorvo US, Inc. His experience in these organizations has allowed him to refine his expertise in laminate substrate technology and contribute to various innovative projects.

Collaborations

Paul has collaborated with several talented individuals in his field, including Tarak A Railkar and Frank J Juskey. These collaborations have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Paul D Bantz is a distinguished inventor whose work in laminate substrate technology has made a lasting impact on the industry. His innovative patents and collaborations with leading companies and professionals highlight his commitment to advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…