The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Feb. 17, 2004
Frank J. Juskey, Apopka, FL (US);
Daniel K. Lau, San Francisco, CA (US);
Lawrence R. Thompson, San Jose, CA (US);
Frank J. Juskey, Apopka, FL (US);
Daniel K. Lau, San Francisco, CA (US);
Lawrence R. Thompson, San Jose, CA (US);
Advanced Interconnect Technologies Limited, Port Louis, MU;
Abstract
An semiconductor device package () includes a semiconductor device (die) () and passive devices () electrically connected to a common lead frame (). The lead frame () is formed from a stamped and/or etched metallic structure and includes a plurality of conductive leads () and a plurality of interposers (). The passive devices () are electrically connected to the interposers (), and I/O pads () on the die () are electrically connected to the leads (). The die (), passive devices (), and lead frame () are encapsulated in a molding compound (), which forms a package body (). Bottom surfaces () of the leads () are exposed at a bottom face () of the package ().