The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Feb. 11, 2015
Triquint Semiconductor, Inc., Hillsboro, OR (US);
Frank J. Juskey, Opopka, FL (US);
Robert C. Hartmann, Opopka, FL (US);
Thomas S. Morris, Lewisville, NC (US);
Howard T. Glascock, Graham, NC (US);
Jose F. Ordonez, Longwood, FL (US);
TriQuint Semiconductor, Inc., Hillsboro, OR (US);
Abstract
Embodiments include but are not limited to apparatuses and systems including microelectronic devices including a package substrate, a plurality of electronic components disposed on and electrically coupled with the package substrate at one or more sides of the package substrate, one or more hollow cavity sheet molds surrounding the plurality of electronic components and coupled with one or more sides of the package substrate, and a plurality of through-mold vias to couple the package substrate with an external surface of at least one of the one or more hollow cavity sheet molds. The microelectronic device may be a chip-scale package or module. Methods and systems for making the same also are described.