Robert C Hartmann

Title: Robert C Hartmann: Innovator in Substrate Structures

Introduction

Robert C Hartmann is a notable inventor based in Opopka, FL (US). He has made significant contributions to the field of substrate structures, particularly in the area of flip chip assembly. With a total of 6 patents to his name, Hartmann's work showcases his innovative approach to technology.

Latest Patents

One of Hartmann's latest patents is titled "Substrate structure with selective surface finishes for flip chip assembly." This patent relates to a substrate structure that incorporates selective surface finishes used in flip chip assembly, along with a process for its fabrication. The disclosed substrate structure consists of a substrate body, a metal structure featuring a first finish area and a second finish area, a first surface finish, and a second surface finish. The metal structure is formed on the top surface of the substrate body, with the first surface finish applied over the first finish area and the second surface finish over the second finish area. Notably, the first surface finish differs from the second surface finish, highlighting the innovative nature of Hartmann's work.

Career Highlights

Throughout his career, Robert C Hartmann has worked with prominent companies in the technology sector. He has been associated with Qorvo US, Inc. and Triquint Semiconductor Corporation, where he has contributed to various projects and advancements in semiconductor technology.

Collaborations

Hartmann has collaborated with several professionals in his field, including Thomas Scott Morris and Frank J Juskey. These collaborations have likely enriched his work and contributed to the development of his innovative patents.

Conclusion

Robert C Hartmann is a distinguished inventor whose work in substrate structures has made a significant impact in the field of flip chip assembly. His innovative patents and career achievements reflect his dedication to advancing technology.