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Taichung, Taiwan

Feng-Lung Chien

USPTO Granted Patents = 8 (Patent Applications = 2)

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 60(Granted Patents)

Location History:

Taichung, TW (2001 - 2004)
Taiwan, CN (2009)
Taichung Hsien, TW (2008 - 2013)
Taiwan, TW (2014)

Company Filing History:

Siliconware Precision Industries Co., Ltd.

Years Active: 2001-2014

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8 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8866293 - Semiconductor structure and fabrication method thereof (2014-10-21),

2. 8569162 - Conductive bump structure on substrate and fabrication method thereof (2013-10-29),

3. 7489037 - Semiconductor device and fabrication method thereof (2009-02-10),

4. 7341949 - Process for forming lead-free bump on electronic component (2008-03-11),

5. 6753609 - Circuit probing contact pad formed on a bond pad in a flip chip package (2004-06-22),

6. 6692629 - Flip-chip bumbing method for fabricating solder bumps on semiconductor wafer (2004-02-17),

7. 6348401 - Method of fabricating solder bumps with high coplanarity for flip-chip application (2002-02-19),

8. 6258705 - Method of forming circuit probing contact points on fine pitch peripheral bond pads on flip chip (2001-07-10),

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