Location History:
- Taichung, TW (2021 - 2022)
- Nantou County, TW (2023)
Company Filing History:
Years Active: 2021-2025
Title: Innovations in Semiconductor Technology by Feng-Jung Chang
Introduction
Feng-Jung Chang is an accomplished inventor based in Taichung, Taiwan, known for his significant contributions to semiconductor technology. With a total of five patents to his name, Chang has developed inventive methods and structures that enhance the functionality and efficiency of semiconductor devices.
Latest Patents
Two of Feng-Jung Chang's latest patents showcase his expertise in the semiconductor field. The first patent describes a semiconductor structure and manufacturing method that includes a substrate with buried word line structures, a transistor structure, and multiple hard mask layers. This innovative design features an arrangement that optimizes the positioning of elements to improve performance.
The second patent involves a dynamic random access memory (DRAM) design with buried word lines incorporated into chop structures of varying widths. This design enhances the substrate's capacity and enables more efficient data processing.
Career Highlights
Feng-Jung Chang is currently employed at Winbond Electronics Corporation, a leading name in the semiconductor industry. Throughout his career, he has consistently focused on innovations that contribute to the advancement of semiconductor applications. His patents reflect a dedication to improving technology in the ever-evolving field of electronics.
Collaborations
Within Winbond Electronics Corporation, Feng-Jung Chang collaborates with fellow engineers and inventors, including Chang-Hung Lin and Tzu-Ming Ou Yang. These collaborations foster a dynamic environment of creativity and innovation, leading to the development of groundbreaking technologies.
Conclusion
Feng-Jung Chang exemplifies the spirit of innovation within the semiconductor industry, with a focus on improving device functionality through his inventive patents. His contributions not only enhance current technologies but also pave the way for future advancements in semiconductor manufacturing and design.