The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2024

Filed:

Jul. 06, 2022
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Chang-Hung Lin, Taichung, TW;

Feng-Jung Chang, Taichung, TW;

Tzu-Ming Ou Yang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10B 12/00 (2023.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H10B 12/053 (2023.02); H01L 21/76224 (2013.01); H10B 12/31 (2023.02); H10B 12/34 (2023.02);
Abstract

Provided is a DRAM including: a substrate, a plurality of chop structures, and a plurality of buried word lines. The plurality of chop structures are located in the substrate. Each of the plurality of chop structures comprises a first portion and a second portion. The first portion is located above the second portion, and a width of the second portion is less than a width of the first portion. The plurality of buried word lines, located at bottoms of a plurality of buried word line trenches. The plurality of buried word line trenches passes through the first portion of the plurality of chop structures and the substrate.


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