Singapore, Singapore

Faxing Che

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015-2025

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3 patents (USPTO):

Title: **Innovative Contributions of Inventor Faxing Che in Singapore**

Introduction

Faxing Che is a renowned inventor based in Singapore, SG, who has made significant contributions to the field of integrated circuit packaging technology. With a strong focus on innovation, he has developed a patented solution aimed at improving the performance and reliability of fan-out wafer level packaging.

Latest Patents

Faxing Che holds a notable patent entitled "Reducing warpage for fan-out wafer level packaging." This invention addresses the challenges associated with warpage in fan-out wafer level packaging, which includes an integrated circuit featuring a top surface, a bottom surface, multiple side surfaces, and a bond pad situated on the top surface. His patent describes a layer of encapsulant that effectively surrounds the side surfaces of the integrated circuit, with a height equal to that of the integrated circuit. Additionally, the design incorporates a bump positioned apart from the integrated circuit, while a redistribution layer electrically connects the bond pad of the integrated circuit to the bump. This innovative approach not only enhances packaging efficiency but also improves the overall reliability of the integrated circuits.

Career Highlights

Faxing Che is currently employed at STMicroelectronics GmbH, a leading global semiconductor company known for its advanced electronic solutions. His expertise and focus on innovation have proven invaluable to the company, enhancing its capabilities in developing cutting-edge technologies.

Collaborations

Throughout his career, Faxing Che has had the privilege of working alongside talented professionals, including Yonggang Jin and Xavier Baraton. These collaborations have fostered an environment of creativity and innovation, contributing significantly to the success of their projects within the realm of integrated circuits.

Conclusion

In conclusion, Faxing Che is an outstanding inventor who has made noteworthy advancements in fan-out wafer level packaging technology. His singular patent reflects his commitment to improving integrated circuit performance and reliability. With a solid career at STMicroelectronics GmbH and collaborative efforts with esteemed colleagues, Faxing Che continues to be a valuable asset in the innovation landscape of Singapore.

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