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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12506134 B1

PDFFull Text
Date of Patent:
Dec. 23, 2025

Filed:

Oct. 27, 2022

Fan-out packaging for a multichip package

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Faxing Che, Singapore, SG;

Yeow Chon Ong, Toa Payoh, SG;

Wei Yu, Singapore, SG;

Ling Pan, Singapore, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Harrity & Harrity, LLP

Primary Examiner:

Thao P Le

Int. Cl.
CPC ...
H01L 25/18 (2023.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/4857 (2013.01); H01L 21/568 (2013.01); H01L 23/3128 (2013.01); H01L 23/49811 (2013.01); H01L 23/5383 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48147 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01);
Abstract

Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly may include a controller, a first mold compound surrounding the controller, a plurality of semiconductor dies, a second mold compound surrounding the plurality of semiconductor dies, and one or more through-mold interconnects electrically coupling the controller to the plurality of semiconductor dies.

Find Patent Forward Citations

Quick Actions:

Che, Faxing. (2025). Fan-out packaging for a multichip package (U.S. Patent No. 12506134). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12506134

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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