Company Filing History:
Years Active: 2007-2015
Title: Eric M. Schulz: Innovator in Chemical Mechanical Polishing Technologies
Introduction
Eric M. Schulz is an accomplished inventor based in Worcester, MA, known for his significant contributions to the field of chemical mechanical polishing (CMP) technology. With a total of six patents to his name, Schulz has been instrumental in advancing the technology used in semiconductor manufacturing and other precision engineering applications.
Latest Patents
Among his recent innovations, Schulz has developed several notable patents. One of his key inventions is an abrasive tool designed for use as a chemical mechanical planarization pad conditioner. This tool includes a substrate with a first major surface and a second major surface, both equipped with layers of abrasive grains, enhancing the efficiency of CMP processes. Another pivotal patent features a CMP conditioner that boasts a ceramic substrate with micro-protrusions arranged in various patterns, allowing for optimized polishing of materials.
Career Highlights
Throughout his career, Eric Schulz has worked with prestigious companies like Saint-Gobain Abrasives, Inc. and Saint-Gobain Abrasifs. His expertise in abrasive technologies and CMP has placed him at the forefront of research and development in the industry, affirming his reputation as a leading innovator in his field.
Collaborations
Schulz has collaborated with notable professionals such as Jianhui Wu and Srinivasan Ramanath, contributing to the advancement of CMP technologies through their collective knowledge and expertise. These collaborations have enabled innovative breakthroughs, further enhancing the applications of abrasive tools in various industries.
Conclusion
Eric M. Schulz exemplifies the spirit of innovation through his dedicated work in the field of chemical mechanical polishing. His patents reflect a commitment to enhancing manufacturing processes and improving technology, marking him as a prominent figure among inventors in the domain. His continued contributions are sure to influence the future of CMP technologies and beyond.