Saint-gobain Abrasives, Inc.

Saint-gobain Abrasifs

Eric M Schulz

Jianhui Wu

Srinivasan Ramanath

Ramanujam Vedantham

Taewook Hwang

Thomas Puthanangady

Charles Dinh-Ngoc

Richard W J Hall

Sergej-Tomislav V Buljan

Gilles Querel

J Gary Baldoni

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Abrasive tool for use as a chemical mechanical planarization pad conditioner

A chemical mechanical polishing (CMP) conditioner includes a ceramic substrate having a major surface, and an abrasive coating overlying the major surface. The major surface can include micro-protrusions arranged in a curved pattern. Alternatively, the micro-protrusions can be arranged in an irregular pattern.

Chemical mechanical polishing conditioner

An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.

Corrosion-resistant CMP conditioning tools and methods for making and using same

A CMP pad conditioner including a substrate having a transparency window represented by an average internal transmittance of not less than about 90% over a wavelength range extending from about 400 nm to about 500 nm along a path length extending through the substrate of not less than about 10 mm a bonding layer overlying a surface of the substrate, and abrasive grains contained within the bonding layer.

Chemical mechanical planarization pad conditioner and method of forming

A drum grinding wheel includes an elongated drum configured for coaxial engagement with a spindle of a grinding machine. An exterior surface of the drum extends parallel to a central axis, and a plurality of removable cutters are removably fastened to the exterior surface. Each of the cutters has a plurality of ribs disposed in spaced relation thereon, and abrasive grain is disposed on a grinding face of each of the ribs, such as by use of a metallic braze.

Growing community of inventors

Worcester, MA, United States of America

Eric M Schulz