The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 09, 2014

Filed:

Jun. 01, 2010
Applicants:

Jianhui Wu, Ashland, MA (US);

Taewook Hwang, Acton, MA (US);

Ramanujam Vedantham, Worcester, MA (US);

Charles Dinh-ngoc, Holliston, MA (US);

Thomas K. Puthanangady, Shrewsbury, MA (US);

Eric M. Schulz, Worcester, MA (US);

Srinivasan Ramanath, Holden, MA (US);

Inventors:

Jianhui Wu, Ashland, MA (US);

Taewook Hwang, Acton, MA (US);

Ramanujam Vedantham, Worcester, MA (US);

Charles Dinh-Ngoc, Holliston, MA (US);

Thomas K. Puthanangady, Shrewsbury, MA (US);

Eric M. Schulz, Worcester, MA (US);

Srinivasan Ramanath, Holden, MA (US);

Assignees:

Saint-Gobain Abrasives, Inc., Worcester, MA (US);

Saint-Gobain Abrasifs, Conflans-Sainte-Honorine, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/12 (2006.01); B24B 53/017 (2012.01); B24D 3/08 (2006.01); B24D 18/00 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24D 3/08 (2013.01); B24B 53/12 (2013.01); B24D 18/00 (2013.01);
Abstract

An abrasive tool for conditioning CMP pads includes abrasive grains coupled to a substrate through a metal bond and a coating, e.g., a fluorine-doped nanocomposite coating. The abrasive grains can be arranged in a self-avoiding random distribution. In one implementation, an abrasive tool includes a coated plate and a coated abrasive article that has two abrading surfaces. Other implementations related to a process for producing an abrasive tool that includes a coating at one or more of its surfaces. Also described are methods for dressing a CMP pad.


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