The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 2015

Filed:

Nov. 20, 2012
Applicants:

Charles Dinh-ngoc, Holliston, MA (US);

Srinivasan Ramanath, Holden, MA (US);

Eric M. Schulz, Worcester, MA (US);

Jianhui Wu, Westerville, OH (US);

Thomas Puthanangady, Shrewsbury, MA (US);

Ramanujam Vedantham, Worcester, MA (US);

Taewook Hwang, Acton, MA (US);

Inventors:

Charles Dinh-Ngoc, Holliston, MA (US);

Srinivasan Ramanath, Holden, MA (US);

Eric M. Schulz, Worcester, MA (US);

Jianhui Wu, Westerville, OH (US);

Thomas Puthanangady, Shrewsbury, MA (US);

Ramanujam Vedantham, Worcester, MA (US);

Taewook Hwang, Acton, MA (US);

Assignees:

Saint-Gobain Abrasives, Inc., Worcester, MA (US);

Saint-Gobain Abrasifs, Conflans-Sainte-Honorine, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/12 (2006.01); B24B 53/017 (2012.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 37/04 (2013.01); B24B 53/12 (2013.01);
Abstract

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.


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