Edward Then

Title: Edward Then: Innovator in Semiconductor Packaging

Introduction

Edward Then is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.

Latest Patents

One of Edward's latest patents is the "Thermal leadless array package with die attach pad locking feature." This invention focuses on a thermal leadless array package that incorporates a die attach pad locking feature, enhancing reliability through a positive mechanical locking mechanism. The design includes a copper layer that is half-etched on both surfaces to define an array of package contacts and a die attach pad, with each pad fully embedded in encapsulate material.

Another significant patent is the "Capillary underfill and mold encapsulation method and apparatus." This method involves attaching a die to a substrate and underfilling the space between them with a first material. Following this, a second material is placed in contact with the die and substrate. The system includes a semiconductor package with a substrate, a die, underfill material, and a molding material, along with a heat sink in thermal contact with the package.

Career Highlights

Edward has worked with prominent companies in the technology sector, including Intel Corporation and Utac Dongguan Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies and packaging solutions.

Collaborations

Throughout his career, Edward has collaborated with talented individuals such as Yin Men Lai and Choong Kooi Chee. These partnerships have likely fostered innovation and creativity in his projects.

Conclusion

Edward Then is a distinguished inventor whose work in semiconductor packaging has led to valuable patents that enhance the reliability and efficiency of electronic devices. His contributions continue to impact the industry positively.