The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 28, 2007
Filed:
Sep. 30, 2003
Yin Men Lai, Seremban, MY;
Choong Kooi Chee, Penang, MY;
Edward Then, Penang, MY;
Cheong Huat NG, Penang, MY;
Mun Fai Low, Penang, MY;
Yin Men Lai, Seremban, MY;
Choong Kooi Chee, Penang, MY;
Edward Then, Penang, MY;
Cheong Huat Ng, Penang, MY;
Mun Fai Low, Penang, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.