This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2007-2008.
Company Filing History:
Years Active: 2007-2008
Title: Innovations of Yin Men Lai
Introduction
Yin Men Lai is an accomplished inventor based in Seremban, Malaysia. He has made significant contributions to the field of technology, particularly in semiconductor packaging. With a total of 2 patents, his work reflects a commitment to advancing innovative solutions in the industry.
Latest Patents
Yin Men Lai's latest patents include the "Perpendicularly oriented electrically active element method and system." This invention provides an apparatus, a system, and a method that features a generally rectilinear body with a first surface and a second surface. The second surface is substantially perpendicular to the first surface, with an electrically operative element disposed on the first surface. The design includes spaced apart terminations on the second surface, which are electrically coupled with the opposite ends of the electrically operative element, allowing for effective coupling with a substrate.
Another notable patent is the "Capillary underfill and mold encapsulation method and apparatus." This method involves packaging a die by attaching it to a substrate and underfilling the space between the die and the substrate with a first material. Following this, a second material is placed in contact with the die and substrate. The system includes a semiconductor package with a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with both the substrate and the die. Additionally, a heat sink is in thermal contact with the semiconductor package, enhancing its performance.
Career Highlights
Yin Men Lai is currently employed at Intel Corporation, where he continues to innovate and contribute to the field of semiconductor technology. His work at Intel has positioned him as a key player in the development of advanced packaging solutions.
Collaborations
Yin Men Lai has collaborated with notable colleagues, including Benjamin Selvaraj and Choong Kooi Chee. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.
Conclusion
Yin Men Lai's contributions to the field of technology through his patents and work at Intel Corporation highlight his role as a significant inventor. His innovative methods in semiconductor packaging demonstrate a commitment to advancing the industry and improving technological solutions.