This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Cheong Huat Ng: Innovator in Semiconductor Packaging
Introduction
Cheong Huat Ng is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative patents. His work is particularly recognized for enhancing the efficiency and reliability of semiconductor devices.
Latest Patents
Cheong Huat Ng holds a patent for a "Capillary underfill and mold encapsulation method and apparatus." This invention involves a method of packaging a die, which includes attaching the die to a substrate. The process underfills the space between the die and the substrate with a first material, followed by placing a second material in contact with at least a portion of the die and the substrate. The system described in the patent features a semiconductor package that includes a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. Additionally, a heat sink is in thermal contact with the semiconductor package. This innovative approach addresses critical challenges in semiconductor manufacturing.
Career Highlights
Cheong Huat Ng is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor technology. His role at Intel has allowed him to work on cutting-edge projects that push the boundaries of what is possible in the field of electronics.
Collaborations
Throughout his career, Cheong Huat Ng has collaborated with talented individuals such as Yin Men Lai and Choong Kooi Chee. These collaborations have fostered an environment of innovation and creativity, leading to the development of impactful technologies.
Conclusion
Cheong Huat Ng's contributions to semiconductor packaging through his patent and work at Intel Corporation highlight his role as an influential inventor in the technology sector. His innovative methods continue to shape the future of semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile