The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 2015
Filed:
Jul. 03, 2012
Albert Loh, Fremont, CA (US);
Edward Then, Penang, MY;
Serafin Pedron, Jr., Manteca, CA (US);
Saravuth Sirinorakul, Bangkok, TH;
Albert Loh, Fremont, CA (US);
Edward Then, Penang, MY;
Serafin Pedron, Jr., Manteca, CA (US);
Saravuth Sirinorakul, Bangkok, TH;
UTAC DONGGUAN LTD., Dongguan, CN;
Abstract
Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.