Intel Corporation

Utac Dongguan Ltd.

Edward Then

Saravuth Sirinorakul

Choong Kooi Chee

Serafin Padilla Pedron, Jr

Albert Loh

Yin Men Lai

Cheong Huat Ng

Mun Fai Low

Embodiments of the present invention are directed to a thermal leadless array package with die attach pad locking feature and methods of producing the same. A copper layer is half-etched on both surfaces to define an array of package contacts and a die attach pad. Each die attach pad is fully embedded in encapsulate material to provide a positive mechanical locking feature for better reliability. In some embodiments, the contacts include four active corner contacts.

Thermal leadless array package with die attach pad locking feature

A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.

Capillary underfill and mold encapsulation method and apparatus

Growing community of inventors

Penang, Malaysia

Edward Then