This inventor holds 1 USPTO granted patent. Top assignees: Nexperia B.v., Zhuhai Access Semiconductor Co., Ltd. Active years: 2025.
Company Filing History:
1 out of 167 
1 out of 35 Years Active: 2025
Title: Edward Tena: Innovator in Package Substrate Manufacturing
Introduction
Edward Tena is a notable inventor based in Guangdong, China. He has made significant contributions to the field of package substrate manufacturing, showcasing his expertise through innovative methods and techniques. His work has led to the development of a unique patent that enhances the efficiency and effectiveness of manufacturing processes.
Latest Patents
Edward Tena holds a patent for a package substrate manufacturing method. This method includes several steps: providing a bearing plate, manufacturing a pattern, and depositing metal to form the first circuit layer. It also involves manufacturing a pattern on the first circuit layer, depositing and etching metal to create a metal cavity, laminating a dielectric layer on the metal cavity, and performing thinning to expose the metal cavity. The process continues with the removal of the bearing plate, etching the metal cavity to expose it, depositing metal on the cavity and dielectric layer, and performing pattern manufacturing and etching to form a second circuit layer. Finally, the method includes forming first and second solder mask layers on the respective circuit layers and cutting the cavity, first circuit layer, second circuit layer, and solder mask layers.
Career Highlights
Throughout his career, Edward Tena has worked with prominent companies in the semiconductor industry. He has been associated with Zhuhai Access Semiconductor Co., Ltd and Nexperia B.V., where he has applied his skills and knowledge to advance technology in package substrate manufacturing.
Collaborations
Edward has collaborated with talented individuals such as Xianming Chen and Benxia Huang. These collaborations have contributed to the development of innovative solutions in the field.
Conclusion
Edward Tena is a distinguished inventor whose work in package substrate manufacturing has made a significant impact in the industry. His innovative methods and collaborations with other professionals highlight his commitment to advancing technology. His contributions continue to influence the field and inspire future innovations.