Nexperia B.v.

Zhuhai Access Semiconductor Co., Ltd

Edward Tena

Lei Feng

Benxia Huang

Wenshi Wang

Xianming Chen

Jindong Feng

Yuan Li

Lina Jiang

Yujun Zhao

Jinxin Yi

Frank Burmeister

A package substrate manufacturing method includes: providing a bearing plate, manufacturing a pattern and depositing metal to form the first circuit layer; manufacturing a pattern on the first circuit layer, depositing and etching metal to form a metal cavity, laminating a dielectric layer on the metal cavity, and performing thinning to expose the metal cavity; removing the bearing plate, etching the metal cavity to expose the cavity, depositing metal on the cavity and the dielectric layer, and performing pattern manufacturing and etching to form a second circuit layer; forming a first and second solder mask layers correspondingly on the first and second circuit layers, and performing pattern manufacturing on the first solder mask layer or the second solder mask layer to form a bonding pad; and cutting the cavity, the first circuit layer, the second circuit layer, the first solder mask layer and the second solder mask layer.

Package substrate manufacturing method

Growing community of inventors

Guangdong, China

Edward Tena