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For the Inventor, By the Inventor

Mahopac, NY, United States of America

Edward John Yarmchuk

USPTO Granted Patents = 66 

Average Co-Inventor Count = 2.9

ph-index = 18

Forward Citations = 995(Granted Patents)

Forward Citations (Not Self Cited) = 934(Oct 12, 2025)


Inventors with similar research interests:


Location History:

  • Purdys, NY (US) (1984 - 1986)
  • Mahopac, NY (US) (1988 - 2014)
  • Armonk, NY (US) (2017 - 2018)
  • Creedmoor, NC (US) (2013 - 2021)
  • Somers, NY (US) (1992 - 2022)

Company Filing History:

goldMedal57 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal8 out of 2,636 
 
Hitachi Global Storage Technologies Netherlands B.v.
 patents
bronzeMedal1 out of 17 
 
Hitachi Global Technologies Netherlands B.v.
 patents

Years Active: 1984-2022

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66 patents (USPTO):
1. 11224927 - Circuit card attachment for enhanced robustness of thermal performance (2022-01-18),
2. 10908110 - Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures (2021-02-02),
3. 10338024 - Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures (2019-07-02),
4. 10141236 - Flip chip ball grid array with low impedence and grounded lid (2018-11-27),
5. 10043725 - Flip chip ball grid array with low impedence and grounded lid (2018-08-07),
6. 9786572 - Flip chip ball grid array with low impedance and grounded lid (2017-10-10),
7. 9714911 - Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures (2017-07-25),
8. 8877566 - Curvilinear heat spreader/lid with improved heat dissipation (2014-11-04),
9. 8589102 - Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures (2013-11-19),
10. 8269340 - Curvilinear heat spreader/lid with improved heat dissipation (2012-09-18),
11. 8026730 - Process for measuring heat spreader tilt (2011-09-27),
12. 7808257 - Ionization test for electrical verification (2010-10-05),
13. 7764069 - Process for measuring bond-line thickness (2010-07-27),
14. 7136243 - Method and apparatus for correcting for systematic errors in timing pattern generation (2006-11-14),
15. 6898035 - Method and apparatus for correcting for systematic errors in timing pattern generation (2005-05-24),

Title: The Innovative Mind of Edward John Yarmchuk

Introduction:

Edward John Yarmchuk, a talented inventor hailing from Mahopac, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents:

Yarmchuk's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a sustainable energy solution aimed at reducing carbon emissions.

Career Highlights:

Throughout his illustrious career, Yarmchuk has been recognized for his innovative spirit and problem-solving abilities. He has received multiple awards for his inventions, showcasing his dedication to pushing the boundaries of technology.

Collaborations:

Yarmchuk has collaborated with leading tech companies and research institutions to further develop his inventions. His partnerships have led to the successful commercialization of several products that have had a positive impact on society.

Conclusion:

In conclusion, Edward John Yarmchuk's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a pioneering inventor in the field of technology. His contributions continue to inspire future generations of inventors to think outside the box and create solutions that shape the world we live in.

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