The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2014

Filed:

Aug. 15, 2012
Applicants:

Michael A. Gaynes, Vestal, NY (US);

Maurice Mcglashan-powell, Mount Vernon, NY (US);

Soojae Park, Wappingers Falls, NY (US);

Edward J. Yarmchuk, Mahopac, NY (US);

Inventors:

Michael A. Gaynes, Vestal, NY (US);

Maurice McGlashan-Powell, Mount Vernon, NY (US);

Soojae Park, Wappingers Falls, NY (US);

Edward J. Yarmchuk, Mahopac, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 2924/3511 (2013.01); H01L 2224/16 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/10253 (2013.01);
Abstract

A heat spreader or lid for a microelectronic package, in which the heat spreader has an underside surface that includes at least one curvilinear contour, in which the curvilinear contour is selected from at least one positive or protruding curvilinear feature, at least one negative or recessed curvilinear feature, and a combination thereof. A microelectronic package that includes the heat spreader/lid, in which there is improved heat dissipation or reduced mechanical stress in an interface between the heat spreader/lid and a circuit chip.


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