Using in situ capacitance measurements to monitor the stability of interface materials in complex pcb assemblies and other structures

Abstract

An electric potential is applied to first and second electrodes on opposite sides of a gap between an electronic component and a heat spreader. At least one of a thermal interface material in the gap, the electronic component and the heat spreader is subjected to a changing physical condition. The electrical capacitance between the electrodes is monitored during the changing physical condition. Such a method can be practiced using an array of components sharing a common heat spreader. An assembly for testing thermal interfaces includes a printed circuit board, a plurality of electronic components mounted to and operatively associated with the printed circuit board, a heat spreader positioned for absorbing heat generated by the electronic components, a first electrode associated with the heat spreader, a plurality of second electrodes associated, respectively, with the electronic component, and a device for monitoring electrical capacitances between the first and second electrodes. The technique may be employed for monitoring physical changes in electronic devices and other structures having interfaces between components.