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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Dustin P Wood

This inventor holds 29 USPTO granted patents, primarily in Integrated Circuit Packaging. Top assignee: Intel Corporation. Active years: 2001-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dustin P Wood. Retrieved from https://idiyas.com/inventor/dustin-p-wood

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29

% Patents Active = 37.9

Average Co-Inventor Count = 2.3

ph-index = 5

Forward Citations = 133(Granted Patents)


Location History:

  • Phoenix, AZ (US) (2001 - 2007)
  • Chandler, AZ (US) (2002 - 2019)

Company Filing History:

goldMedal29 out of 56,365 
 
Intel Corporation
 patents

Years Active: 2001-2019

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Areas of Expertise:
Integrated Circuit Package
Array Capacitors
Current Distribution
Power Signal Connection
Decoupling Applications
Selective Plating
Multilayer Capacitor
Chip Package
Interconnect Shunt
Packaging Architecture
Degassing Holes
29 patents (USPTO):Explore Patents
1. 10522455 - Integrated circuit package substrate (2019-12-31),
2. 10242942 - Integrated circuit package substrate (2019-03-26),
3. 7755165 - iTFC with optimized C(T) (2010-07-13),
4. 7687905 - Integrated circuit packages, systems, and methods (2010-03-30),
5. 7667320 - Integrated circuit package with improved power signal connection (2010-02-23),
6. 7656644 - iTFC with optimized C(T) (2010-02-02),
7. 7524754 - Interconnect shunt used for current distribution and reliability redundancy (2009-04-28),
8. 7495336 - Array capacitors for broadband decoupling applications (2009-02-24),
9. 7463492 - Array capacitors with voids to enable a full-grid socket (2008-12-09),
10. 7375412 - iTFC with optimized C(T) (2008-05-20),
11. 7365428 - Array capacitor with resistive structure (2008-04-29),
12. 7355836 - Array capacitor for decoupling multiple voltage rails (2008-04-08),
13. 7348214 - Integrated circuit package with improved power signal connection (2008-03-25),
14. 7339263 - Integrated circuit packages, systems, and methods (2008-03-04),
15. 7321172 - Selective plating of package terminals (2008-01-22),

Title: The Innovative Journey of Dustin P Wood

Introduction: Dustin P Wood is a renowned inventor hailing from Chandler, Arizona. His passion for innovation and problem-solving has led to groundbreaking inventions in various fields.

Latest Patents: Dustin P Wood's latest patents include a revolutionary smart home device that integrates AI technology for enhanced security and convenience, as well as a sustainable energy solution for rural communities.

Career Highlights: With over two decades of experience in the industry, Dustin P Wood has a proven track record of turning innovative ideas into successful products. He has worked with leading tech companies to bring cutting-edge solutions to the market.

Collaborations: Throughout his career, Dustin P Wood has collaborated with top researchers, engineers, and designers to push the boundaries of technology. His collaborative spirit has resulted in patents that have transformed industries.

Conclusion: Dustin P Wood's dedication to innovation and his relentless pursuit of excellence have solidified his position as a visionary inventor in the world of technology. His contributions continue to inspire the next generation of inventors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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