The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 2009
Filed:
Dec. 27, 2005
Mark Bohr, Aloha, OR (US);
Jun He, Portland, OR (US);
Fay Hua, San Jose, CA (US);
Dustin P. Wood, Chandler, AZ (US);
Mark Bohr, Aloha, OR (US);
Jun He, Portland, OR (US);
Fay Hua, San Jose, CA (US);
Dustin P. Wood, Chandler, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
In one embodiment of the invention, an integrated circuit package includes an integrated circuit, a package substrate, a first bump, a second bump and a shunt to provide for current distribution and reliability redundancy. The first and second bumps provide a first and second electric current pathway between the integrated circuit and package substrate. The shunt provides a third electric current pathway between the first bump and the second bump.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile