Dong Woon Park

Dong Woon Park, based in Seoul, South Korea, is a prolific inventor with a whopping 221 patents under his belt. His latest patents are a device for measuring the thickness of a specimen and a method for measuring the thickness of a specimen. This method allows for contactless and non-destructive measurement of the thickness of a specimen with multiple layers.

Park's latest invention is beneficial not only in reducing the time it takes to measure the thickness of a specimen but also in calculating the thicknesses of each of the specimen's layers. This is made possible by differences in reflection and transmission times of terahertz waves with respect to each of the specimen's layers.

Park's areas of expertise span a wide range of applications, giving his latest invention cross-industry potential. In the past, he has worked with the Industry-University Cooperation Foundation Hanyang University and SOLiD, INC. Along with coworkers Byoung Hwa Lee and Min Cheol Park, he has invented various technologies that have contributed to his impressive portfolio of patents.

One of Park's most significant contributions to technology is his invention, a method for simultaneous transmission of control signals, terminal therefore, method for receiving control signal, and base station therefor, which allows for a simultaneous transmission of control signals in wireless communication systems.

With Park's extensive patent portfolio and knowledge, he is a notable figure in the industry, and his inventions will continue to shape and advance technology across a range of fields.