Hsinchu, Taiwan

Dong-Sing Wuu

This inventor holds 9 USPTO granted patents. Top assignees: Industrial Technology Research Institute, Visual Photonics Epitaxy Co., Ltd.. Active years: 1995-2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong-Sing Wuu. Retrieved from https://idiyas.com/inventor/dong-sing-wuu-4bfhfidx

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 88.9

Average Co-Inventor Count = 4.2

ph-index = 6

Forward Citations = 373(Granted Patents)


Location History:

  • Changhua, TW (2000)
  • Hsinchu, TW (1995 - 2001)
  • Chang-Hua Hsien, TW (2002)

Company Filing History:


Years Active: 1995-2002

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9 patents (USPTO):Explore Patents

Title: The Innovations of Dong-Sing Wuu

Introduction

Dong-Sing Wuu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of technology, particularly in the development of advanced manufacturing methods for inkjet print heads and light-emitting diodes (LEDs). With a total of nine patents to his name, Wuu's work has greatly influenced the efficiency and cost-effectiveness of these technologies.

Latest Patents

One of Wuu's latest patents is a manufacturing method of monolithic integrated thermal bubble inkjet print heads. This innovative method utilizes semiconductor manufacturing technologies to configure various elements within the print head on a single substrate. The ink channels are formed on the top surface of the substrate using anisotropic etching techniques, while the ink slot is created on the back surface. The energy transducer and orifice plate are then formed above the ink channels using coating and etching techniques. This method enhances production efficiency and reduces costs by eliminating the need for precision alignment joints typically required in conventional inkjet print heads.

Another notable patent is for a light-emitting diode with a metal-coated reflective permanent substrate. The manufacturing process involves growing a light-emitting region on a temporary substrate, bonding it to a metal-coated reflective permanent substrate, and subsequently removing the temporary substrate. The reflective metal layer also acts as a bonding agent. During the heating process in a wafer bonding tool, the differing thermal expansion coefficients between stainless steel and graphite help to apply pressure, ensuring a strong bond between the LED element and the permanent substrate.

Career Highlights

Wuu has worked with esteemed organizations such as the Industrial Technology Research Institute and Visual Photonics Epitaxy Co., Ltd. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking advancements in technology.

Collaborations

Throughout his career, Wuu has collaborated with notable colleagues, including Ten-Hsing Jaw and Ray-Hua Horng. These partnerships have fostered an environment of innovation and creativity, leading to the development of impactful technologies.

Conclusion

Dong-Sing Wuu's contributions to the fields of inkjet printing and light-emitting diodes exemplify the spirit of innovation. His patents not only enhance production processes but also pave the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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