The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2001
Filed:
Oct. 04, 1999
Kuo-Hsiung Chang, Tao-Yuan Hsien, TW;
Kun-Chuan Lin, Taipei, TW;
Ray-Hua Horng, Chang-Hua Hsien, TW;
Man-Fang Huang, Hsinchu Hsien, TW;
Dong-Sing Wuu, Hsinchu, TW;
Sun-Chin Wei, Tai-Nan Hsien, TW;
Visual Photonics Epitaxy Co., Ltd., Taoyuan, TW;
Abstract
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a metal-coated reflective permanent substrate and then removing the temporary substrate. The reflective metal layer also serves as a bonding agent for bonding the permanent substrate. The bonded LED element and permanent substrate are heated in a wafer bonding tool that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the bonded structure during the heating process to assist the bonding of the permanent substrate.