The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2001
Filed:
May. 10, 1999
Kuo-Hsiung Chang, Tao-Yuan Hsien, TW;
Kun-Chuan Lin, Taipei, TW;
Ray-Hua Horng, Chang-Hua Hsien, TW;
Man-Fang Huang, Hsinchu Hsien, TW;
Dong-Sing Wuu, Hsinchu, TW;
Sun-Chin Wei, Yung-Kuang, TW;
Lung-Chien Chen, Pa-Te, TW;
Visual Photonics Epitaxy Co., Ltd., Taoyuan, TW;
Abstract
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting region and then removing the temporary substrate. A metal bonding agent also serving as an ohmic contact layer with LED is used to bond the transparent substrate to form a dual substrate LED element which is then heated in a wafer holding device that includes a graphite lower chamber and a graphite upper cover with a stainless steel screw. Because of the different thermal expansion coefficients between stainless and graphite, the stainless steel screw applies a pressure to the dual substrate LED element during the heating process to assist the bonding of the transparent substrate.