Dong Hyeon Park

Title: The Innovative Contributions of Dong Hyeon Park

Introduction

Dong Hyeon Park is a notable inventor based in Seoul, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique patent that enhances the manufacturing process of semiconductor devices.

Latest Patents

Dong Hyeon Park holds a patent for a method titled "Hybrid bonding interconnection using laser and thermal compression." This patent describes a process for manufacturing a semiconductor device that involves providing an electronic component over a substrate. The interconnect of the electronic component contacts a conductive structure of the substrate. The substrate is then placed over a laser-assisted bonding tool, which includes a stage block with a window. The interconnect is heated with a laser beam through the window until it is bonded with the conductive structure. This innovative method showcases his expertise in semiconductor manufacturing.

Career Highlights

Dong Hyeon Park is currently employed at Amkor Technology Singapore Holding Pte. Ltd. His work at this company has allowed him to further develop his skills and contribute to advancements in semiconductor technology. His dedication to innovation is evident in his patent and the impact it has on the industry.

Collaborations

Throughout his career, Dong Hyeon Park has collaborated with talented individuals such as Min Ho Kim and Seok Ho Na. These collaborations have likely enriched his work and contributed to the success of his projects.

Conclusion

Dong Hyeon Park is a distinguished inventor whose work in semiconductor technology has led to significant advancements. His patent for hybrid bonding interconnection demonstrates his innovative spirit and commitment to improving manufacturing processes. His contributions are valuable to the field and highlight the importance of continued innovation in technology.