The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2026

Filed:

Nov. 11, 2022
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Dong Hyeon Park, Seoul, KR;

Yun Ah Kim, Gyeonggi-do, KR;

Seok Ho Na, Incheon, KR;

Won Ho Choi, Incheon, KR;

Dong Su Ryu, Incheon, KR;

Jo Hyun Bae, Incheon, KR;

Min Jae Kong, Seoul, KR;

Jin Young Khim, Seoul, KR;

Jae Yeong Bae, Incheon, KR;

Dong Hee Kang, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 23/367 (2006.01); H01L 23/42 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/42 (2013.01); H01L 21/52 (2013.01); H01L 21/563 (2013.01); H01L 23/053 (2013.01); H01L 23/3672 (2013.01); H01L 23/49822 (2013.01); H01L 23/562 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01);
Abstract

In one example, an electronic device comprises a substrate comprising a conductive structure and an inner side and an outer side, a first electronic component over the inner side of the substrate and coupled with the conductive structure, a lid over the substrate and the first electronic component and comprising a first hole in the lid, and a thermal interface material between the first electronic component and the lid. The thermal interface material is in the first hole. Other examples and related methods are also disclosed herein.


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