The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 05, 2023

Filed:

Jun. 23, 2020
Applicant:

Amkor Technology Singapore Holding Pte. Ltd., Singapore, SG;

Inventors:

Min Ho Kim, Seoul, KR;

Seok Ho Na, Incheon, KR;

Dong Hyeon Park, Seoul, KR;

Choong Hoe Kim, Seoul, KR;

Woo Kyung Ju, Gyeonggi-do, KR;

Yun Seok Song, Gwangju, KR;

Dong Su Ryu, Incheon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/50 (2014.01); H01L 23/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 24/81 (2013.01); B23K 26/50 (2015.10); H01L 24/75 (2013.01); B23K 2101/40 (2018.08); H01L 2224/75263 (2013.01); H01L 2224/81048 (2013.01); H01L 2224/81201 (2013.01); H05K 2201/068 (2013.01);
Abstract

In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.


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