Woo Kyung Ju

Title: Woo Kyung Ju: Innovator in Semiconductor Technology

Introduction

Woo Kyung Ju is a notable inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.

Latest Patents

Woo Kyung Ju holds a patent for a method titled "Hybrid bonding interconnection using laser and thermal compression." This patent describes a process for manufacturing a semiconductor device. The method involves providing an electronic component over a substrate, where an interconnect of the electronic component contacts a conductive structure of the substrate. The substrate is then placed over a laser-assisted bonding (LAB) tool, which includes a stage block with a window. The interconnect is heated with a laser beam through the window until it is bonded with the conductive structure. Other examples and related methods are also disclosed in this patent.

Career Highlights

Woo Kyung Ju is currently employed at Amkor Technology Singapore Holding Pte. Ltd. His work focuses on advancing semiconductor manufacturing techniques, contributing to the efficiency and effectiveness of electronic components.

Collaborations

He has collaborated with notable coworkers, including Min Ho Kim and Seok Ho Na, who share his commitment to innovation in the semiconductor industry.

Conclusion

Woo Kyung Ju's contributions to semiconductor technology through his patent demonstrate his expertise and dedication to innovation. His work continues to influence the field and pave the way for future advancements.