Amkor Technology Singapore Holding Pte. Ltd.

Dong Hyeon Park

Min Ho Kim

Choong Hoe Kim

Seok Ho Na

Dong Su Ryu

Yun Seok Song

Woo Kyung Ju

In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

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Seoul, South Korea

Dong Hyeon Park