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For the Inventor, By the Inventor

Shenzhen, China

Dong-Bo Zheng

This inventor holds 11 USPTO granted patents and 2 published patent applications. Top assignees: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.. Active years: 2008-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong-Bo Zheng. Retrieved from https://idiyas.com/inventor/dong-bo-zheng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11 

% Patents Active = 18.2

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 66(Granted Patents)


Company Filing History:

goldMedal11 out of 1,231 
 
Foxconn Technology Co., Ltd.
 patents
silverMedal11 out of 778 
 
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2008-2012

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11 patents (USPTO):Explore Patents
1. 8096136 - Heat dissipation device (2012-01-17),
2. 7969728 - Heat dissipation device with a fan holder attached with a position-adjustable air guiding member (2011-06-28),
3. 7929309 - Heat sink assembly having clip (2011-04-19),
4. 7874692 - LED lamp (2011-01-25),
5. 7866376 - Heat dissipation device with U-shaped and S-shaped heat pipes (2011-01-11),
6. 7760509 - Heat dissipation device having fastening structure (2010-07-20),
7. 7746640 - Heat dissipation device with heat pipes (2010-06-29),
8. 7643300 - Heat dissipation device for memory module cards (2010-01-05),
9. 7637311 - Heat dissipation device (2009-12-29),
10. 7537046 - Heat dissipation device with heat pipe (2009-05-26),
11. 7345879 - Heat dissipation device (2008-03-18),

Title: The Innovative Contributions of Dong-Bo Zheng

Introduction

Dong-Bo Zheng is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of heat dissipation technology, holding a total of 11 patents. His innovative designs have enhanced the efficiency and effectiveness of cooling systems in various electronic applications.

Latest Patents

One of Zheng's latest patents is a heat dissipation device that includes a base, a fin group mounted on top of the base, a fan mounted on the fin group, a hollow fan duct, and a thermoelectric cooler secured on the fan duct. This device utilizes a cooling module with the Peltier effect, which extends through the sidewall of the fan duct. The airflow generated by the fan first flows through the heat sink and then reaches the fin group, optimizing heat dissipation. Another notable patent is a heat dissipation device featuring a fan holder attached to a position-adjustable air guiding member. This design allows for airflow to be directed towards electronic components, enhancing cooling efficiency.

Career Highlights

Dong-Bo Zheng has worked with notable companies such as Fu Zhun Precision Industry Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has contributed to his expertise in developing advanced cooling solutions.

Collaborations

Throughout his career, Zheng has collaborated with talented individuals, including Meng Fu and Chun-Chi Chen. These partnerships have fostered innovation and creativity in his projects.

Conclusion

Dong-Bo Zheng's contributions to heat dissipation technology are noteworthy, and his patents reflect his commitment to innovation. His work continues to influence the design and efficiency of cooling systems in the electronics industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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