The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2010
Filed:
Oct. 19, 2009
Pin-qun Zhao, Shenzhen, CN;
Dong-bo Zheng, Shenzhen, CN;
Meng Fu, Shenzhen, CN;
Chun-chi Chen, Taipei Hsien, TW;
Pin-Qun Zhao, Shenzhen, CN;
Dong-Bo Zheng, Shenzhen, CN;
Meng Fu, Shenzhen, CN;
Chun-Chi Chen, Taipei Hsien, TW;
Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province, CN;
Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien, TW;
Abstract
A heat dissipation device for removing heat from an electronic component mounted on a printed circuit board, includes a heat sink having a bottom for in contact with the electronic component and a plurality of fasteners securing the heat sink onto the printed circuit board. Each fastener includes a first latching member, a second latching member rotatably connected to the first latching member and an operating member rotatably connected to the first latching member and having a pressing part engaging a curved portion defined on a top of the second latching member. The heat sink and the printed circuit board are located between the first and second latching members of each fastener. The operating member is rotated to force the first and the second latching members to rotate toward each other to closely clip the heat sink and printed circuit board together.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile